# Halo Industries gets $75 million conditional Pentagon loan commitment for silicon carbide wafers

The Office of Strategic Capital says its financing would help the laser-based wafer producer approach cost parity with foreign competitors.

Published 2026-11-05 by TGOs. Canonical: https://tgos.io/news/2026/11/05/halo-industries-gets-75-million-conditional-pentagon-loan-commitment/

The Department of War’s Office of Strategic Capital (OSC) announced a $75 million conditional loan commitment to Halo Industries to expand production of silicon carbide (SiC) semiconductor wafers.[1] OSC says the investment brings in an additional $75 million in private capital and supports Halo’s domestic manufacturing expansion.[1]

The office expects its conditional financing to help Halo expand U.S. manufacturing and approach cost parity with foreign competitors.[1] OSC says heavy state subsidies to foreign competitors have pressured domestic SiC wafer producers and increased reliance on overseas supply.[1]

Halo uses lasers to slice SiC ingots into wafers in place of mechanical diamond saws.[1] OSC says the process reduces material waste, improves throughput up to tenfold and lowers production costs.[1]

The loan commitment still requires Halo to satisfy financial, legal, technical, investment, due diligence and other requirements before financial close.[1]

## Why it matters

OSC says Halo’s Santa Clara, California, operations would onshore production of components vital to high-voltage defense applications, including advanced radar, electronic warfare, hypersonics and directed energy weapons.[1] The office expects the manufacturing expansion to reduce reliance on foreign semiconductor materials.[1]

## Sources

1. Department of War: Office of Strategic Capital Signs $75 Million Conditional Loan Commitment With Halo Industries, Inc. <https://www.war.gov/News/Releases/Release/Article/4642227/department-of-wars-office-of-strategic-capital-signs-75-million-conditional-loa/>
