Capital
Halo Industries gets $75 million conditional Pentagon loan commitment for silicon carbide wafers
The Office of Strategic Capital says its financing would help the laser-based wafer producer approach cost parity with foreign competitors.
The Department of War’s Office of Strategic Capital (OSC) announced a $75 million conditional loan commitment to Halo Industries to expand production of silicon carbide (SiC) semiconductor wafers. OSC says the investment brings in an additional $75 million in private capital and supports Halo’s domestic manufacturing expansion.1
OSC announced a $75 million conditional loan commitment with Halo Industries
Halo's domestic manufacturing expansion
to scale production of SiC wafers
satisfying various financial, legal, technical, investment, due diligence, and other requirements
Source: Department of War, Office of Strategic Capital (OSC). As of November 5, 2026.
Sources
The office expects its conditional financing to help Halo expand U.S. manufacturing and approach cost parity with foreign competitors. OSC says heavy state subsidies to foreign competitors have pressured domestic SiC wafer producers and increased reliance on overseas supply.1
Halo uses lasers to slice SiC ingots into wafers in place of mechanical diamond saws. OSC says the process reduces material waste, improves throughput up to tenfold and lowers production costs.1
The loan commitment still requires Halo to satisfy financial, legal, technical, investment, due diligence and other requirements before financial close.1
OSC says Halo’s Santa Clara, California, operations would onshore production of components vital to high-voltage defense applications, including advanced radar, electronic warfare, hypersonics and directed energy weapons. The office expects the manufacturing expansion to reduce reliance on foreign semiconductor materials.1
Sources (1)
- Department of War: Office of Strategic Capital Signs $75 Million Conditional Loan Commitment With Halo Industries, Inc. www.war.gov